Chag Sameach - Sweet Stamp Embosser
Add a festive touch to your pastry creations with the "Chag Sameach" embosser from Sweet Stamp. This product allows you to easily emboss trendy patterns into your fondant, modeling chocolate, or gum paste, creating beautiful and precise decorations every time.
Main Features:
- Brand: Sweet Stamp
- Name: Chag Sameach Embosser
- Dimensions: 60 mm
- Material: Biodegradable PLA
- Use: Embossing patterns on fondant, modeling chocolate, gum paste, etc.
Description:
The "Chag Sameach" pattern from Sweet Stamp is perfect for adding a festive and joyful touch to your cookies, cupcakes, and other pastry creations. Made in Australia with high-quality materials, this embosser is designed to deliver clear and sharp results with every use.
Usage:
- Preparation: Roll your fondant, sugar paste, or gum paste to an even thickness.
- Application: Place the "Chag Sameach" embosser on the paste and press firmly to transfer the pattern.
- Decoration: Gently lift the embosser to reveal the embossed design. Paint or leave unpainted according to your preference.
Benefits:
- Ease of Use: Simple to use, even for beginners. Create beautiful embossed patterns in just a few steps.
- Versatility: Ideal for round cookies of 70 mm and larger, hexagonal cookies, and heart-shaped cookies of 76 mm.
- Durability: Made from biodegradable PLA, a plastic derived from renewable resources such as corn starch, sugarcane, and tapioca roots.
- Easy Maintenance: Hand wash only. Keep below 50 degrees Celsius to preserve product quality.
Why Choose the "Chag Sameach" Embosser from Sweet Stamp?
- Festive Design: The phrase "Chag Sameach" means "Happy Holidays," bringing a touch of joy and festivity to your creations.
- Superior Quality: Carefully made in Australia, ensuring sharp and precise results.
- Eco-Friendly: Designed in biodegradable PLA, environmentally friendly.
Add the "Chag Sameach" embosser from Sweet Stamp to your collection of baking tools and create beautiful, festive decorations for all your special occasions.
